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0.25mm Black 94v0 FR4 Multilayer PCB Board With Gold Finger Impedance Control

Global Success Circuits Co.,Ltd
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    Buy cheap 0.25mm Black 94v0 FR4 Multilayer PCB Board With Gold Finger Impedance Control from wholesalers
     
    Buy cheap 0.25mm Black 94v0 FR4 Multilayer PCB Board With Gold Finger Impedance Control from wholesalers
    • Buy cheap 0.25mm Black 94v0 FR4 Multilayer PCB Board With Gold Finger Impedance Control from wholesalers

    0.25mm Black 94v0 FR4 Multilayer PCB Board With Gold Finger Impedance Control

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    Brand Name : Global Success Circuits Co.,Ltd
    Model Number : GSC-3DA45
    Certification : UL E324220, ISO9001, ISO14001
    Price : US$ 0.3 - 3.5 / Piece
    Payment Terms : T/T, D/P, D/A, L/C, Western Union
    Supply Ability : 100,000㎡/Month
    Delivery Time : 3 - 15 days
    • Product Details
    • Company Profile

    0.25mm Black 94v0 FR4 Multilayer PCB Board With Gold Finger Impedance Control

    0.25mm Black 94v0 FR4 Multilayer PCB Board With Gold Finger Impedance Control


    FR4 Multilayer PCB with Gold finger and impedance control , Black 94v0 solder mask BGA PCB


    Printed Circuit Board Manufacturing Capabilities Summary

    In the table below is a comprehensive list of Global Success's key printed circuit board manufacturing capabilities. This list is designed to help you understand if Global Success's capabilities are a match for your design. It will also allow you to plan ahead and create your design within these capabilities so that you can be sure Global Success can produce your PCB.


    OVERALL BOARD FEATURES

    LAYER COUNT

    UP TO 14

    THICKNESS MINIMUM

    .025"

    THICKNESS MAXIMUM

    .200"

    THICKNESS TOLERANCE

    +/- 10%

    BOW AND TWIST TOLERANCE

    0.5%

    MAXIMUM PCB Panel SIZE(s)

    Up to 10" X 16" (on a 12" X 18" panel; this panel size is commonly used)
    Up to 16" X 22" (on a 18" X 24" panel; this panel size is commonly used)
    Up to 19" X 27" (on a 21" X 29" panel; this panel size is not as common)

    MATERIALS AND DIELECTRICS

    MATERIALS

    FR-4 FAMILY


    POLYIMIDE


    ROGERS 3000 SERIES


    ROGERS 4000 SERIES



    BONDING SHEETS - PRE-PREG

    TO MATCH CORE MATERIAL


    HYBRID CONSTRUCTIONS

    INNER LAYER THICKNESS MINIMUM

    .005"

    DIELECTRIC MINIMUM

    .003"

    INNER COPPER THICKNESS - MIN (BASE)

    .0007" (1/2 OZ)

    INNER LAYER COPPER THICKNESS - MAX

    .0028" (2 OZ)

    OUTER COPPER THICKNESS - MIN (BASE)

    .0007" (1/2 OZ)

    OUTER COPPER THICKNESS - MAX (BASE)

    .0055"(4 OZ)

    HOLES

    SMALLEST MECHANICALLY DRILLED HOLE

    .010"

    SMALLEST LASER HOLE

    .006"

    PLATING - SPECIAL HOLES - MIN

    .0008"

    MAXIMUM PLATING IN HOLES

    .001" - .002"

    PLATED HOLE TOLERANCE - DIAMETER

    .004"

    PLATING ASPECT RATIO - MAXIMUM

    12:1

    HOLE PREP TYPE

    PERMANGANATE


    PLASMA

    LINE AND SPACE

    INNER LAYER LINE WIDTH MINIMUM

    .004"

    INNER TRACE WIDTH TOLERANCE

    +/- .001"

    OUTER LAYER LINE WIDTH MINIMUM

    .004"

    OUTER LAYER SPACE MINIMUM

    .004"

    OUTER TRACE WIDTH TOLERANCE

    +/- .001"

    PADS

    PAD SIZE OVER HOLE DIAMETER

    .015"

    SOLDERMASK

    TYPE

    LPI - MOST COLORS


    THERMAL CURE

    PAD CLEARANCE MINIMUM

    .006"

    MINIMUM LINE WIDTH - MASK

    .005"

    REGISTRATION TOLERANCE

    .004"

    FINAL FINISH

    HOT AIR LEVEL

    .0005" -.0015"

    HARD GOLD

    30-50 MICROINCHES

    SOFT BONDABLE GOLD

    20-40 MICROINCHES

    FULL BODY GOLD

    20-40 MICROINCHES

    ELECTROLESS NICKEL

    100-200 MICROINCHES

    IMMERSION GOLD

    3-5 MICROINCHES

    TIN/NICKEL

    100-300 MICROINCHES

    IMMERSION SILVER

    3-4 MICROINCHES

    LEGEND

    TYPE

    MOST COLORS

    CHARACTER LINE WIDTH MINIMUM

    .007"

    FINAL FABRICATION


    V-GROOVE ARRAY


    ROUTED PIECE


    COUNTERSINK


    COUNTERBORE


    EDGE BEVEL


    EDGE-MILL

    MINIMUM INSIDE RADIUS

    .015"

    ELECTRICAL TEST

    TYPE

    CLAM-SHELL


    FLYING PROBE


    TDR

    TEST SPECIFICATION

    IPC CLASS I, II, III

    REPORTS AVAILABLE ON REQUEST

    TYPE

    MICROSECTION


    SOLDERABILITY


    X-RAY FLUORESCENCE


    IONIC CONTAMINATION

    CONTROLLED IMPEDANCE

    TESTING

    TDR

    TYPE

    SINGLE END


    DIFFERENTIAL

    METAL CORE

    TYPE

    ALUMINUM

    BLIND VIA PROCESSING

    TYPE

    SEQUENTIAL LAM

    SMALLEST HOLE

    .006"

    SILVER OR EPOXY FILL

    AVAIL SEQ LAM

    MICRO VIA PROCESSING

    SMALLEST HOLE

    .010"

    SILVER OR EPOXY FILL

    .010"

    MICRO VIA PROCESSING


    SMALLEST HOLE

    .006"

    CAPTURE PAD OVER HOLE SIZE - MIN

    .012"

    PLATING ASPECT RATIO

    .5:1

    DIELECTRIC - MICROVIA LAYER

    .002" (+/- .0005)

    MATERIALS - MICROVIA LAYER

    RESIN COATED FOIL


    NON-WOVEN ARAMID

    PCB SPECIFICATIONS

    IPC CLASS

    IPC-A-600 CLASS I, II, III

    MILITARY

    ROUTED PIECE

    LEAD TIMES


    24 HOUR - QUICK TURN


    24 HOUR - QUICK TURN


    72 HOUR - QUICK TURN


    MEDIUM VOLUME


    HIGH VOLUME


    How we can guarantee the quality of our products?

    1,Design Rule Chekc (DRC)


    The Design Rules Check (DRC) is a very important step in PCB quality control . we will use an automated tool to verify that the layout does not have any specific placement, routing or other addressable layout errors. All of your boards must include DRC.


    2, Automated optical inspection (AOI)


    AOI is for checking the inner layers of multi-layers PCB. It scans the surface of the PCB and compares with our data, eg,line width,line space, excess copper, missing copper.hole breakage.
    All multi-layers have to pass AOI .


    3 ,ISO9001


    We are ISO 9001:2015 certificated, For the following activities Project management and logistics control for the production of printed circuit boards.


    4, Manufacturing Rule Check (MRC)


    Some free versions and latest versions softwares always have bugs which DRC can not pick up the mistakes.,we will do MRC here, MRC will check your designs, such as missing pads,missing polygon copper, Wrong width/space to do .


    5, Electrical Testing (ET)


    ET is testing the netlist generated from your design/gerber. It can defect Short /open ciruit. Prototypes:testing by fly probe. Production:Testing by A fixture. All boards have to pass ET.


    6, UL


    Our products comply with UL safety certification 94V-0.


    Our MI and CAM engineers have over 5 years experience.the picture below is an example that many customers designed inner layer short or open circuit.
    We have the eagle eye to pick this out and optimize the designs to perfect manufacturing process.



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