PCB Fabrication Capability |
No | Item | PCB Process Capability |
1 | base material | Normal TG FR4, High TG FR4, PTFE, Rogers, Low Dk/Df etc. |
2 | Solder mask color | green, red, blue, white, yellow, purple,black |
3 | Legend color | white, yellow, black, red |
4 | Surface treatment type | ENIG, Immersion tin, HAF, HAF LF, OSP, flash gold, gold finger,
sterling silver |
5 | Max. layer-up(L) | 14 |
6 | Max. unit size (mm) | 620*813 (24″*32″) |
7 | Max. working panel size (mm) | 620*900 (24″x35.4″) |
8 | Max. board thickness (mm) | 3.5 |
9 | Min. board thickness(mm) | 0.3 |
10 | Board thickness tolerance (mm) | T<1.0 mm: +/-0.10mm ; T≥1.00mm: +/-10% |
11 | Registration tolerance (mm) | +/-0.10 |
12 | Min. mechanical drilling hole diameter (mm) | 0.15 |
13 | Min. laser drilling hole diameter(mm) | 0.075 |
14 | Max. aspect(through hole) | 15:1 |
| Max. aspect(micro-via) | 1.3:1 |
15 | Min. hole edge to copper space(mm) | L≤10, 0.15；L=12-22,0.175；L=24-34, 0.2；L=36-44, 0.25；L＞44, 0.3 |
16 | Min. Inner layer clearance(mm) | 0.15 |
17 | Min. hole edge to hole edge space(mm) | 0.28 |
18 | Min. hole edge to profile line space(mm) | 0.2 |
19 | Min. Inner layer copper to profile line space (mm) | 0.2 |
20 | Registration tolerance between holes (mm) | ±0.05 |
21 | Max. finished copper thickness(um) | Outer Layer: 420 (12oz)
Inner Layer: 210 (6oz) |
22 | Min. trace width (mm) | 0.075 (3mil) |
23 | Min. trace space (mm) | 0.075 (3mil) |
24 | Solder mask thickness (um) | line corner : >8 (0.3mil)
upon copper: >10 (0.4mil) |
25 | ENIG golden thickness (um) | 0.025-0.125 |
26 | ENIG nickle thickness (um) | 3-9 |
27 | Sterling silver thickness (um) | 0.15-0.75 |
28 | Min. HAL tin thickness (um) | 0.75 |
29 | Immersion tin thickness (um) | 0.8-1.2 |
30 | Hard-thick gold plating gold thickness (um) | 1.27-2.0 |
31 | golden finger plating gold thickness (um) | 0.025-1.51 |
32 | golden finger plating nickle thickness(um) | 3-15 |
33 | flash gold plating gold thickness (um) | 0,025-0.05 |
34 | flash gold plating nickle thickness (um) | 3-15 |
35 | profile size tolerance (mm) | ±0.08 |
36 | Max. solder mask plugging hole size (mm) | 0.7 |
37 | BGA pad (mm) | ≥0.25 (HAL or HAL Free:0.35) |
38 | V-CUT blade position tolerance (mm) | +/-0.10 |
39 | V-CUT position tolerance (mm) | +/-0.10 |
40 | Gold finger bevel angle tolerance (o) | +/-5 |
41 | Impedance tolerance (%) | +/-5% |
42 | Warpage tolerance (%) | 0.75% |
43 | Min. legend width (mm) | 0.1 |
44 | Fire flame class | 94V-0 |
Special for Via in pad products | Resin plugged hole size (min.) (mm) | 0.3 |
Resin plugged hole size (max.) (mm) | 0.75 |
Resin plugged board thickness (min.) (mm) | 0.5 |
Resin plugged board thickness (max.) (mm) | 3.5 |
Resin plugged maximum aspect ratio | 8:1 |
Resin plugged minimum hole to hole space (mm) | 0.4 |
Can difference hole size in one board? | yes |
| Max. panel size (finished) (mm) | 880 ×580 |
Max. working panel size (mm) | 914 × 602 |
Max. board thickness (mm) | 12 |
Max. layer-up(L) | 40 |
Aspect | 30:1 (Min. hole: 0.4 mm) |
Line wide/space (mm) | 0.075/ 0.075 |
Back drill capability | Yes |
Tolerance of back drill (mm) | ±0.05 |
Tolerance of press fit holes (mm) | ±0.05 |
Surface treatment type | OSP, sterling silver, ENIG |
Rigid-flex board | Hole size (mm) | 0.2 |
Dielectrical thickness (mm) | 0.025 |
Working Panel size (mm) | 350 x 500 |
Line wide/space (mm) | 0.075/ 0.075 |
Stiffener | Yes |
Flex board layers (L) | 8 (4plys of flex board) |
Rigid board layers (L) | ≥14 |
Surface treatment | All |
Flex board in mid or outer layer | Both |
Special for HDI products | Laser drilling hole size (mm) | 0.075 |
Max. dielectric thickness (mm) | 0.15 |
Min. dielectric thickness (mm) | 0.05 |
Max. aspect | 1.5:1 |
Bottom Pad size (under micro-via) (mm) | Hole size+0.15 |
Top side Pad size ( on micro-via) (mm) | Hole size+0.15 |
Copper filling or not (yes or no) (mm) | yes |
Via in Pad design or not ( yes or no) | yes |
Buried hole resin plugged (yes or no) | yes |
Min. via size can be copper filled (mm) | 0.1 |
Max. stack times | 4 |
