Home > 4 Layer PCB Board >

High Temperature Green 1 Oz 4 Layer PCB Board For Medical Control System

Product Categories

Global Success Circuits Co.,Ltd

Contact Now

High Temperature Green 1 Oz 4 Layer PCB Board For Medical Control System

Ask Lasest Price
Brand Name :	Global Success Circuits Co.,Ltd
Model Number :	GSC-D42FE
Certification :	ISO 9001:2015 UL , ISO 14001, TS16949
Price :	US$ 0.01 - 0.9 / Piece
Payment Terms :	L/C, D/P, T/T
Delivery Time :	3 - 7 days
Supply Ability :	100000SQM/per month

Add to Cart

Product Details
Company Profile

High Temperature Green 1 Oz 4 Layer PCB Board For Medical Control System

High Temperature Green 1 Oz 4 Layer PCB Board For Medical Control System

Multilayer PCB

Multilayer printed circuit boards (PCBs) represented the next major evolution in fabrication technology. From the base platform of double sided plated thru came a very sophisticated and complex methodology that would again allow circuit board designers a dynamic range of interconnects and applications. Multilayer circuit boards were essential in the advancement of modern computing. The multilayer PCB basic construction and fabrication are similar to micro chip fabrication on a macro size. The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills. Multilayer can be built on ceramic, copper, and aluminum. Blind and buried vias are commonly produced, along with pad on via technology. Manufacturing multilayer circuit boards is a straightforward process but does require a high level of attention to detail. PCB Manufacturing multilayer PCBs requires a specialized hydraulic press with heated platens.

The multilayer PCB is made up by two or more pcbs which are stacked together with reliable predefined mutual connection between them. There are at least three conductive layers in one multilayer PCB with two layers outside and the one layer synthesized in the insulation board. Due to the complex manufacturing process and lower production , the cost of multilayer pcb is relatively higher. Multi-layer PCB needs further design attention as we have to keep some points into consideration from manufacturing perspective:
• Copper areas – on inner layers, all copper should be kept at least and largest value.
• Via clearance through inner layers (antipads)
• Allow for clearance around any holes or via barrels not connected to an inner layer. This clearance should be at least 15 mil although 20 mil clearance is preferred.
• Thermal Relief Pads – the tie should be a minimum of 8 mil while more is preferable.
• Larger geometries – will result in higher yields which will be reflected in your board price.

Category	Description	Capability
Laminate Material	FR4, High TG FR4(tg150,tg170,tg180) Halogen-free FR4, CEM1, CEM3,Polyimide, Rogers ,Aluminum	We will order other special material accoprding to your request
Board Layers	Maximum layers	1-18layers
Size	Maximum finished dimensions	500*1200mm
Board Thickness	Minimum and Maximum	0.2-3.2mm
Copper	Outer copper weight	0.5oz (17um) - 4oz (140um)
Copper	Inner copper weight	0.5oz (17um) - 4 oz (105um)
Drilling	Minimum drilling size	0.15mm
	Drill Deviation (True position size)	2mil (0.050mm)
	PTH hole tolerance	3mil (0.075mm)
	N-PTH hole tolerance	2mil (0.050mm)
	Minimum hole wall thickness	20um
	Angle of Countersink	80°, 90°, 100°, 120°
Circuit line	Minimum width	0.1mm/ 4mil
Circuit line	Minimum space	0.1mm/ 4mil
Inner Layers	Minimum space from drilling to inner pattern	6mil (0.15mm)
	Minimum space from annular ring to inner pattern	6mil (0.15mm)
	Layer-to-layer registration	3mil (0.08mm)
Board Profilling	Hole to board edge tolerance	±4mil (0.1mm)
	Pattern to board edge tolerance	±4mil (0.1mm)
	CNC Tolerance	±4mil (0.1mm)
	Minmum thickness after V-Cut	12mil (0.3mm)
	V-Cut tolerance	±5mil (0.12mm)
	V-Cut Angle	20,30,45,60
Solder mask	Color	green, light green, matte green, white black,matte black,yellow,red, blue
Solder mask	Thickness	≥17um
Silkscreen	Color	White, black, yellow, red, blue, green, gray
	Minimum line height	≥0.0625mm
	Minimum line width	≥0.125mm
Surface Finish	HASL, HASL pb free, immersion gold, immersion silver, O.S.P
Certification	IPC-A-600 Class II/III, UL E324220, ISO 9001,ISO/TS16949, ROHS

PCB fabrication

1. Quick turn: 12 hours for 1 layer, 24 hours for 2 layers and 2-5 days for multilayer.

2. High-tech products including high Tg, high frequency, heavy copper, metal substrate, hybrid, halogen free, micro via, mix-material, backplane, and rigid-flex.

3. Advanced manufacturing and inspection equipment from USA, Japan, Germany and Taiwan.
4. 1-18 layers of rigid PCB, 1-8 layers of FPC, and 1-18 layers of rigid-flex PCB with ENIG, LF HAL, gold finger, immersion silver/tin, OSP, thick gold.

How Are Multilayer PCBs Made?

Alternating layers of prepeg and core materials are laminated together under high temperature and pressure to produce Multilayer PCBs. This process ensures that air isn't trapped between layers, conductors are completely encapsulated by resin, and the adhesive that holds the layers together are properly melted and cured. The range of material combinations is extensive from basic epoxy glass to exotic ceramic or Teflon materials.

The figure below illustrates the stackup of a 4-Layer/ multilayer PCB. Prepreg and core are essentially the same material, but prepreg is not fully cured, making it more malleable than the core.The alternating layers are then placed into a lamination press. Extremely high temperatures and pressures are applied to the stackup, causing the prepeg to "melt" and join the layers together. After cooling off, the end result is a very hard and solid multilayer board.

Product Tags:


*From:	Your email address is incorrect!
*To:	Global Success Circuits Co.,Ltd
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!