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High TG170 Multilayer PCB Fabrication Process 1OZ ENIG Green Long PCB

Global Success Circuits Co.,Ltd
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    Buy cheap High TG170 Multilayer PCB Fabrication Process 1OZ ENIG Green Long PCB from wholesalers
     
    Buy cheap High TG170 Multilayer PCB Fabrication Process 1OZ ENIG Green Long PCB from wholesalers
    • Buy cheap High TG170 Multilayer PCB Fabrication Process 1OZ ENIG Green Long PCB from wholesalers

    High TG170 Multilayer PCB Fabrication Process 1OZ ENIG Green Long PCB

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    Brand Name : Global Success Circuits Co.,Ltd
    Model Number : GPC12580
    Certification : ISO 9001-2008, ISO TS 16949 ,UL
    Price : US$ 0.3 - 1.3 / Piece
    Payment Terms : L/C, D/P, T/T, Western Union
    Delivery Time : 1 - 15 days
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    High TG170 Multilayer PCB Fabrication Process 1OZ ENIG Green Long PCB

    High TG170 Multilayer PCB Fabrication Process 1OZ ENIG Green Long PCB


    Number of layers: 6 layers
    Material: FR4
    Board thickness: 1.6mm
    Surface plating: ENIG 2U''
    Solder mask: Green
    Special process description: NO


    WHO IS GSC?
    Global Success Circuits(www.szgpc.com) is pcb manufacturer with 3 facotries located in Shenzhen, Jiangxi, Jiangsu.

    Quality
    • State-of-the-art, ISO/TS and UL certified PCB manufacturers
    • First Article-Certificate of Quality Compliance provided with each lot.
    Products
    • Rigid PCB’s
    • Aluminum and copper core PCB’s
    • Class 2 & 3

    ItemMass productionSmall batch production
    Number of layersUP TO 18LUP TO L
    Laminate typeFR-4, halogen free, high TG(Shengyi, KB), Cem-3, PTFE, aluminum based, PTEE, Rogers or more.FR-4, Halogen free, High TG(Shengyi, KB), Cem-3, PTFE, Aluminum based, PTEE, Rogers or more.
    Maximum board size610mm*1100mm610mm*1100mm
    Board thickness0.1mm-7.00mm<0.1mm and >7.00mm
    Minimum line width/space3.5mil(0.0875mm)3mil(0.075mm)
    Minimum line gap+/-15%+/-10%
    Outer layer copper thickness35um-175um35um-210um
    Inner layer copper thickness12um-175um12um-210um
    Drilling hole size(Mechanical)0.15mm-6.5mm0.15mm-6.5mm
    Finished hole size (Mechanical)0.15mm-6.0mm0.15mm-6.0mm
    Board thickness hole size ratio14:116:1
    Board thickness tolerance(t=0.8mm)±8%±5%
    Board thickness tolerance(t<0.8mm)±10%±8%
    Min. grid line width4mil(12, 18, 35um), 6mil(70um)4mil(12, 18, 35um), 6mil(70um)
    Min. grid spacing6mil(12, 18, 35um), 8mil(70um)6mil(12, 18, 35um), 8mil(70um)
    Hole size tolerance(Mechanical)0.05-0.075mm0.05mm
    Hole position tolerance(Mechanical)0.005mm0.005mm
    Solder mask colorGreen, Blue, Black, White, Yellow, Red, Grey etc.Green, Blue, Black, White, Yellow, Red, Grey etc.
    Impedance control tolerance+/-10%+/-8%
    Min. distance between drilling to conductor(non-blind buried orifice)8mil(8L), 9mil(10L), 10mil(14L), 12mil(26L)6mil(8L), 7mil(10L), 8mil(14L), 12mil(26L)
    Min. Character width and height(35um base copper)Line width: 5mil
    Height: 27mil
    Line width: 5mil; height: 27mil
    Max. test voltage500V500V
    Max. test current200mA200mA

    Surface treatment
    Flash Gold0.025-0.075um0.025-0.5um
    Immersion Gold0.05-0.1um0.1-0.2um
    Sn/Pb HASL1-70um1-70um
    Lead-free HASL1-70um1-70um
    Immersion Silver0.08-0.3um0.08-0.3um
    OSP0.2-0.4um0.2-0.4um
    Gold Finger0.375um>=1.75um
    Hard Gold Plating0.375um>=1.75um
    Immersion Sin0.8um
    V-Cut rest thickness tolerance±0.1mm±0.1mm

    Outline profile
    ChamferThe angle type of the chamfer30,45,60
    Plug via holeMax.size can be plugged0.6mm
    Largest NPTH hole size6.5mm>6.5mm
    Largest PTH hole size6.5mm>6.5mm
    Min. solder spacer ring0.05mm0.05mm
    Min. solder bridge width0.1mm0.1mm
    Drilling diameter0.15mm-0.6mm0.15mm-0.6mm
    Min. pad diameter with hole14mil( 0.15mm drilling)12mil( 0.1mm laser)
    Min. BGA pad diameter10mil8mil
    Chemical ENIG gold thickness0.025-0.1um(1-4U)0.025-0.1um
    Chemical ENIG nickel thickness3-5um(120-200U)3-5um
    Min. resistance testΩ5


    BOARD SPECIFICATIONS:
    Smallest hole size: 0.016" finished
    Minimum Slot width: .032"
    Circuit to score line dimentions within 0.015"
    Score line tolerances: +/- 0.003 inches
    Routing tolerances: +/- 0.005 inches
    Hole size tolerances: +/- 0.003 inchres
    Hole to hole tolerances within 0.005" over 18" distance

    Uncut material thickness tolerances within 0.003"
    Smallest image annular ring: 0.005"
    Smallest circuit width and spacing: 0.005"
    Smallest SMT pitch: 0.016"
    Electrical testing: Bare Board Tester (Universal grid), Test voltage: 150 volts, Continuity: 5 Ohms, Isolation: 100MOhms


    Quality ASSURANCE:
    Global Circuits is ISO 9001:2008 certified.
    Our dedication to building a quality product is the centerpiece of our business policy.
    We are committed to fulfilling our customers' on-going quality requirements through continuous improvements to all of our internal processes. Our quality management system ensures the highest operating standards at all levels.



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