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Quick Turn High TG Multilayer PCB Board 2OZ Copper Thickness 3 Mil Trace

Global Success Circuits Co.,Ltd
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    Buy cheap Quick Turn High TG Multilayer PCB Board 2OZ Copper Thickness 3 Mil Trace from wholesalers
     
    Buy cheap Quick Turn High TG Multilayer PCB Board 2OZ Copper Thickness 3 Mil Trace from wholesalers
    • Buy cheap Quick Turn High TG Multilayer PCB Board 2OZ Copper Thickness 3 Mil Trace from wholesalers

    Quick Turn High TG Multilayer PCB Board 2OZ Copper Thickness 3 Mil Trace

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    Brand Name : Global Success Circuits Co.,Ltd
    Model Number : GPC12580
    Certification : ISO 9001-2008, ISO TS 16949 ,UL
    Price : US$ 0.3 - 1.3 / Piece
    Payment Terms : L/C, D/P, T/T, Western Union
    Delivery Time : 1 - 15 days
    • Product Details
    • Company Profile

    Quick Turn High TG Multilayer PCB Board 2OZ Copper Thickness 3 Mil Trace

    Quick Turn High TG Multilayer PCB Board 2OZ Copper Thickness 3 Mil Trace



    Number of layers: 6 layers
    Material: fr4
    Board thickness: 1.6mm
    Surface plating: ENIG
    Special process description: NO
    Min Line: 3mil


    WHO IS GSC?
    Global Success Circuits(www.szgpc.com) is pcb manufacturer with 3 facotries located in Shenzhen, Jiangxi, Jiangsu.

    Quality
    • State-of-the-art, ISO/TS and UL certified PCB manufacturers
    • First Article-Certificate of Quality Compliance provided with each lot.
    Products
    • Rigid PCB’s
    • Aluminum and copper core PCB’s
    • Class 2 & 3

    ItemMass productionSmall batch production
    Number of layersUP TO 18LUP TO L
    Laminate typeFR-4, halogen free, high TG(Shengyi, KB), Cem-3, PTFE, aluminum based, PTEE, Rogers or more.FR-4, Halogen free, High TG(Shengyi, KB), Cem-3, PTFE, Aluminum based, PTEE, Rogers or more.
    Maximum board size610mm*1100mm610mm*1100mm
    Board thickness0.1mm-7.00mm<0.1mm and >7.00mm
    Minimum line width/space3.5mil(0.0875mm)3mil(0.075mm)
    Minimum line gap+/-15%+/-10%
    Outer layer copper thickness35um-175um35um-210um
    Inner layer copper thickness12um-175um12um-210um
    Drilling hole size(Mechanical)0.15mm-6.5mm0.15mm-6.5mm
    Finished hole size (Mechanical)0.15mm-6.0mm0.15mm-6.0mm
    Board thickness hole size ratio14:116:1
    Board thickness tolerance(t=0.8mm)±8%±5%
    Board thickness tolerance(t<0.8mm)±10%±8%
    Min. grid line width4mil(12, 18, 35um), 6mil(70um)4mil(12, 18, 35um), 6mil(70um)
    Min. grid spacing6mil(12, 18, 35um), 8mil(70um)6mil(12, 18, 35um), 8mil(70um)
    Hole size tolerance(Mechanical)0.05-0.075mm0.05mm
    Hole position tolerance(Mechanical)0.005mm0.005mm
    Solder mask colorGreen, Blue, Black, White, Yellow, Red, Grey etc.Green, Blue, Black, White, Yellow, Red, Grey etc.
    Impedance control tolerance+/-10%+/-8%
    Min. distance between drilling to conductor(non-blind buried orifice)8mil(8L), 9mil(10L), 10mil(14L), 12mil(26L)6mil(8L), 7mil(10L), 8mil(14L), 12mil(26L)
    Min. Character width and height(35um base copper)Line width: 5mil
    Height: 27mil
    Line width: 5mil; height: 27mil
    Max. test voltage500V500V
    Max. test current200mA200mA

    Surface treatment
    Flash Gold0.025-0.075um0.025-0.5um
    Immersion Gold0.05-0.1um0.1-0.2um
    Sn/Pb HASL1-70um1-70um
    Lead-free HASL1-70um1-70um
    Immersion Silver0.08-0.3um0.08-0.3um
    OSP0.2-0.4um0.2-0.4um
    Gold Finger0.375um>=1.75um
    Hard Gold Plating0.375um>=1.75um
    Immersion Sin0.8um
    V-Cut rest thickness tolerance±0.1mm±0.1mm

    Outline profile
    ChamferThe angle type of the chamfer30,45,60
    Plug via holeMax.size can be plugged0.6mm
    Largest NPTH hole size6.5mm>6.5mm
    Largest PTH hole size6.5mm>6.5mm
    Min. solder spacer ring0.05mm0.05mm
    Min. solder bridge width0.1mm0.1mm
    Drilling diameter0.15mm-0.6mm0.15mm-0.6mm
    Min. pad diameter with hole14mil( 0.15mm drilling)12mil( 0.1mm laser)
    Min. BGA pad diameter10mil8mil
    Chemical ENIG gold thickness0.025-0.1um(1-4U)0.025-0.1um
    Chemical ENIG nickel thickness3-5um(120-200U)3-5um
    Min. resistance testΩ5

    SMT Processing
    Now we have 9 SMT Lines and 3 DIP Lines to perform PCB assembly. The precision of chip replacement is up to +0.1MM, this indicates we have professional skills in producing all kinds of printed integrated circuit boards such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA with surface-mount technology (SMT), thru-hole technology (THT) and merged tech components.
    DIP Processing
    Global Success has three DIP processing lines, professional working platforms and carriers, this ensures a output capacity of 1 500 000pcs per day. For every process, technical and standard

    Quality Quick Turn High TG Multilayer PCB Board 2OZ Copper Thickness 3 Mil Trace for sale
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