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High Frequency 3 Mil PCB Trace L HASL Green FR4 PCB Prototype Printed Circuit Board

Global Success Circuits Co.,Ltd
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    Buy cheap High Frequency 3 Mil PCB Trace L HASL Green FR4 PCB Prototype Printed Circuit Board from wholesalers
     
    Buy cheap High Frequency 3 Mil PCB Trace L HASL Green FR4 PCB Prototype Printed Circuit Board from wholesalers
    • Buy cheap High Frequency 3 Mil PCB Trace L HASL Green FR4 PCB Prototype Printed Circuit Board from wholesalers

    High Frequency 3 Mil PCB Trace L HASL Green FR4 PCB Prototype Printed Circuit Board

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    Brand Name : Global Success Circuits Co.,Ltd
    Model Number : GPC12580
    Certification : ISO 9001-2008, ISO TS 16949 ,UL
    Price : US$ 0.3 - 1.3 / Piece
    Payment Terms : L/C, D/P, T/T, Western Union
    Delivery Time : 1 - 15 days
    • Product Details
    • Company Profile

    High Frequency 3 Mil PCB Trace L HASL Green FR4 PCB Prototype Printed Circuit Board

    High Frequency 3 Mil PCB Trace L HASL Green FR4 PCB Prototype Printed Circuit Board


    Number of layers: 4 layers
    Material: Rogers
    Board thickness: 1.0mm
    Surface plating: Lead Free HASL
    Special process description: 1OZ


    Brief introduction of GS:


    1. GS are ISO/TS and UL certified.

    2. 3 factories and more than 1000 employees in China.

    3. With very compitive price and high quality, 50% pcb are exported to Europe and America.


    PCBA/PCB assembly specifications:

    1. PCB layers: 1 to 18 layers (standard)
    2. PCB materials/types: FR4, aluminum, CEM1, super thin PCB, FPC/gold finger, HDI
    3. Assembly service types: DIP/SMT or mixed SMT and DIP
    4. Copper thickness: 0.5-10oz
    5. Assembly surface finish: HASL, ENIG, OSP, immersion tin, immersion Ag, flash gold
    6. PCB dimensions: 450x1500mm
    7. IC pitch (min): 0.2mm
    8. Chip size (min): 0201
    9. Leg distance (min): 0.3mm
    10. BGA sizes: 8x6/55x55mm
    11. SMT efficiency: SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
    12. u-BGA ball diameter: 0.2mm
    13. Required docs for PCBA Gerber file with BOM list and pick-n-place file (XYRS)
    14. SMT speed: chip components SMT speed 0.3S/pieces, max speed 0.16S/pieces

    What can we do for you?

    1. EMS-electronic manufacturing service
    2. PCB supply and layout
    3. PCB assembly on SMT, BGA and DIP
    4. Cost effective components sourcing
    5. Fast turn prototype and mass production
    6. Box build assembly
    7. Engineering supported
    8. Tests (X-ray, 3D paste thickness, ICT, AOI and functional tests)

    For PCBA order, provide us:

    1. PCB Gerber file
    2. BOM list for PCBA
    3. Sample of PCB and PCBA
    4. Test method for PCBA

    Services and applications:

    1. Through hole board assembly
    2. SMT assembly including BGA assembly, smallest placement: 0201
    3. Material procurement
    4. Consigned material management
    5. Plastic or metal enclosure
    6. Complex final assembly
    7. Functional test
    8. Cable assembly
    9. Labeling and packing
    10. Customized logistics per customer
    11. Laser cut framed SMT solder paste stencils
    12. PCB design and schematic capture
    MaterialsStandardAdvanced
    FR4 (130‐180 Tg by DSC)YY
    Halogen FreeYY
    BT EpoxyYY
    GetekYY
    Isola 370HR 406 408 IS410 IS 420 IS620YY
    Nelco 4000YY
    Rogers 4000YY
    PTFEYY
    Dupont PyraluxNY
    Aluminum CoreYY
    Surface Finishes
    ENIGYY
    Flash GoldYY
    Electrolytic Nickel/Hard GoldYY
    HASLYY
    Lead Free HASLYY
    Immersion AgYY
    Standard FeaturesStandardAdvanced
    Maximum layer count2036
    Maximum Panel Size21″x24″24″x30″
    Outer Layer Trace/Spacing (1/3 oz)0.0035″/0.0035″[90μm/90μm]0.0025″/0.003″[64μm/76μm]
    Inner Layer Trace/Spacing (H oz)0.003″/0.003″ [76μm/76μm]0.002″/0.0025″ [50μm/64μm]
    Maximum PCB thickness0.125″[3.2mm]0.177″[4.5mm]
    Minimum PCB thickness0.008″[0.20mm]0.004″[0.10mm]
    Minimum mechancial drill size0.008″[0.20mm]0.004″[0.10mm]
    Maximum PCB aspect ration10:0112:01
    Maximum copper weight5 oz [178μm]6 oz [214μm]
    Minimum copper weight1/3 oz [12μm]1/4 oz [9μm]
    Minimum core thickness0.002″[50μm]0.0015″[38μm]
    Minimum dielectric thickness0.0025″[64μm]0.0015″[38μm]
    Minimum Pad Size over Drill0.018″[0.46mm]0.016″[0.4mm]
    Solder Mask Registration+/‐ 0.002″[50μm]+/‐ 0.0015″[38μm]
    Mimimum Solder Mask Dam0.003″[76μm]0.0025″[64μm]
    Copper feature to PCB edge0.015″[0.38mm]0.010″[0.25mm]
    Tolerance on overall dimensions+/‐ 0.004″[100μm]+/‐ 0.002″[50μm]
    HDI Features
    Immersion TinYY



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